Associate Engineer, R&D Equipment Development - #1164789

This role is fully hands-on and includes, but no limited to the following responsibilities:

• Lead the setup and buy-off of new processes and machines.

• Perform process setup, buy-off and execution of characterization activities, including DOE, prototype, qualification and mass production build.

• Trouble shoot and resolve machine-related issues to ensure smooth operations problem.

• Perform data collection, analysis and consolidation to support engineering activities.

Requirements

• Minimum Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline.

• Experience in high volume electronics manufacturing environment preferably semiconductor assembly.

• Must be familiar and have hands-on experience with either one of the following process and machines, (i) SMT/ AOI, (ii) Reflow Oven, (iii) Flip Chip/ TCB, (iv) Underfill, (v) Lid Attach/ Laser Mark, (vi) Ball Mount/ AOI.

• Familiar with JMP data analysis capability.

• Knowledge and experience on multiple process of the above will be an advantage.

• Proven experience in assembly FOL/ EOL process (at least 3 years' experience).