MTS - Process Integration Lead (TD) - #1174218

About GlobalFoundries

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com.

Introduction

Process integration lead in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

Responsibilities

• Lead process integration activities for the development, optimization, and qualification of RF semiconductor technologies, ensuring device performance, manufacturability, yield, and reliability targets are achieved.
• Design, execute, and analyze Design of Experiments (DOE) to drive process understanding, optimization, and technology development.
• Partner closely with process module, device, yield, reliability, and manufacturing teams to improve product performance and process capability.
• Own and drive complex technical problem-solving activities, utilizing data-driven methodologies to identify root causes and implement robust solutions.
• Serve as the primary technical interface for internal and external customers, addressing technical inquiries and supporting customer engagements.
• Define and establish technology design rules, process monitors, test structures, characterization plans, and qualification methodologies for new technology platforms.
• Drive continuous innovation through the development of novel integration schemes, methodologies, and process improvements to enhance technology competitiveness.
• Mentor junior engineers and provide technical leadership across cross-functional development programs.

Required Qualifications

• Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Electronics Engineering or equivalent.
• Minimum 6 years of relevant semiconductor industry experience with a PhD, or 8 years with a Bachelor’s/Master’s degree.
• Strong wafer fabrication process knowledge with proven experience in FEOL process integration and technology development.
• Demonstrated ability to lead cross-functional technical projects and drive issues to resolution in a fast-paced development environment.
• Strong analytical, problem-solving, and data interpretation skills.

Preferred Qualifications

• Hands-on experience in RF-SOI technology development, integration, characterization, and qualification.
• Understanding of semiconductor device physics, RF device behavior, and RF characterization techniques (e.g., S-parameters) is a plus.
• Experience in process optimization, yield enhancement, reliability qualification, and root-cause analysis methodologies.
• Self-motivated, resourceful, and adaptable, with a strong commitment to continuous learning and technical excellence.
• Excellent communication, leadership, and interpersonal skills, with the ability to influence and collaborate effectively across multidisciplinary teams.
• Experience interfacing with customers and presenting technical results to senior management and external stakeholders.