Dry Process Engineer (Semicon/PCB/Substrate) - #1167771

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The Opportunity:

Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of Dry Process Engineer to join their R&D team.


The Job:

Process Development & Optimization

• You'll own the development and optimization of dry processes including film deposition and etching for advanced packaging solutions.
• Collaborating with cross-functional teams to lead innovations in deposition & etching and their implementation efforts

Equipment & Tooling Support

• Active part of defining deposition and etching equipment specifications and validating tools.
• Work with supplier teams to monitor and maintain tool performance.

Yield & Quality Improvement

• Implement and refine process monitoring techniques and defect inspection, to proactively investigate and resolve issues with dry processes.

Process Integration

• Collaborate with upstream and downstream process owners (e.g., lithography, plating, wet processes, metrology) to ensure seamless integration.
• Support the development of process flows for advanced packaging substrates.

Data Analysis & Documentation

• Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Experience with data analysis software packages (such as MATLAB, Python, SQL, JMP)
• Document standard operating procedures (SOPs), work instructions, and control plans.

Cross-Functional Collaboration

• Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
• Assist with customer qualifications and reliability testing as needed.

The Talent:

• PhD or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
• 5-10+ years of experience in film deposition and dry etching
• Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
• Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
• Strong analytical, documentation, and problem-solving skills.
• Good communication and teamwork in a cross-functional environment.
• Familiarity with using metrology tools for thin film and etch characterization (e.g., XRF, 4PP, ellipsometry, profilometer).
• Takes part in product risk management discussions leveraging his / her expertise and knowledge to influence and drive risk management decisions.
• Using AI/ML to enhance process discovery

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to ••••@adecco.com in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Loo Hui Yang
Direct Line: 93••045
EA License No: 91C2918
Personnel Registration Number: R11011456