PCB Design Engineer - #1166596
Allied Telesis International (ASIA) Pte Ltd
About the role
The PCB Design Engineer is responsible for the design, development, and layout of high-speed printed circuit boards (PCBs) for networking and communication products. The role works closely with Hardware Design Engineers, Mechanical Engineers, Manufacturing, and suppliers to deliver high-quality, manufacturable PCB designs that meet electrical, mechanical, thermal, reliability, and regulatory requirements.
Key responsibilities
Design multilayer high-speed PCB layouts for networking products, including Ethernet switches, routers, wireless access points, gateways, and related communication devices.
Transform the schematics from the hardware design engineers into optimized PCB layouts ensuring signal integrity, power integrity, EMI/EMC compliance, and manufacturability during the PCB layout process.
Perform component placement and routing in line with mechanical requirements while considering thermal performance, impedance control.
Ensure compliance with IPC standards and design guidelines.
Develop PCB stack-ups and routing strategies for high-speed interfaces such as PCIe, DDR3/DDR4/DDR5, USB, SATA, Gigabit/10G/25G/40G/100G Ethernet, SerDes.
Generate fabrication drawings and assembly documentation.
Maintain accurate PCB design documentation and revision control.
Maintain PCB component footprints and component libraries.
Work with PCB suppliers and the manufacturing team to resolve fabrication and assembly issues and implement necessary corrective actions.
Work with the manufacturing team to ensure that the PCB designs conform with DFM/DFT guidelines.
Requirements
· Bachelor's (or higher) degree in Electronics Engineering.
· Minimum four years’ experience in similar capacity.
· Proficiency in Cadence Allegro is preferred.
· Proficiency in the following areas:
High-Speed Design & Signal Integrity: Proficient in controlled impedance, line length matching, and minimizing crosstalk.
EMC & Isolation: Skilled in electromagnetic compatibility and proper plane isolation (digital, analogue, and power).
Thermal Management: Experience in designing for optimal heat dissipation.
Familiar with various interfaces such as Gigabit/10G/25G/40G/100G Ethernet, Serdes, DDR3/4/5, USB, SATA, PCIe.
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