STATS ChipPAC Trainee Program 2026 - #1125360

STATSChipPAC Trainee Program is designed to nurture young, high-potential graduates into future leaders and specialists. This program provides fresh graduates with structured training, mentorship, and real-world exposure to different business functions. Trainees will gain comprehensive knowledge, sharpen their technical and soft skills, and build a strong foundation for their professional journey.

Program detail:

1. Tailored Education Program

• A structured rotational assignment (18–24 months).

• Professional technical and corporate culture training leveraging STATS ChipPAC’s global network.

2. Learning and Development Support

• Coaching: Expert coaching to enhance individual competencies.

• Mentoring: Dedicated mentoring from experienced professionals.

• Peer Learning: Knowledge sharing and teamwork-driven collaboration.

• HR Support: Systematic career development and growth opportunities.

3. Practical, Hands-on Learning

• Collaborate with semiconductor packaging experts through domestic and international assignments.

• Gain real-world problem-solving experience by participating in diverse team projects.

Eligibility:

• Fields of Study: Semiconductor Packaging, Chemical Engineering, IC, Materials Science, Microelectronics, Mechanical Engineering, Industrial Engineering, Optoelectronics, Physics, Electronics, and other related fields.

• Academic Requirements: Master’s or PhD credentials

• Strong teamwork and problem-solving skills.