Semicon Development Engineers (Die prep/chip attach/Mold) - #1123459

Summary

The Development Engineer will support R&D and process integration activities for 2.5D wafer-level packaging (WLP) technologies, focusing on Die Preparation, Chip Attach, and Molding processes.

The role ensures process reliability, manufacturability, and seamless integration for next-generation semiconductor packages used in AI, HPC, and memory applications.

Key Responsibilities

• Develop and optimize Chip-on-Wafer (CoW) processes:

  • Die Preparation: grinding, laser grooving, dicing saw

  • Chip Attach: Thermo-Compression Bonding (TCB), Laser Compression Bonding (LCB)

  • Mold: compression or transfer molding for warpage control and chip protection

• Perform material evaluations and reliability analyses (e.g., XRF, shear test, SAM).

• Design and execute DOE and FMEA to ensure robust process control and yield improvement.

• Collaborate cross-functionally with Bumping, RDL, and Failure Analysis teams for process integration.

• Monitor industry trends in equipment, materials, and 2.5D/3D packaging technologies.

• Support New Product Introduction (NPI) and yield ramp-up through structured problem-solving.

• Prepare and maintain process documentation, including flow charts, risk assessments, and engineering reports.

• Influence supplier qualification and capital equipment decisions related to 2.5D processes.

• Drive production readiness and contribute directly to yield, reliability, and revenue growth.

Requirements

• Bachelor’s degree or higher in Materials, Electronics, Chemical, Mechanical Engineering, or related field.

• Minimum 3 years of hands-on experience in semiconductor packaging process development (Die Prep, Chip Attach, or Mold).

• Strong knowledge of DOE, FMEA, SPC, and failure analysis methodologies.

• Familiarity with analytical and reliability tools such as XRF, shear test, SAM.

• Excellent documentation, data analysis, and cross-functional communication skills.

• Experience in OSAT, Foundry, or Advanced Packaging (2.5D/3D, HBM, Interposer) environments is preferred.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 4RRX3RX5