Business Development Manager / Director - #1123403

Responsibilities:

1. Customer Development and Demand Identification

a) Responsible for market expansion of advanced packaging business, with a focus on identifying customers with needs in emerging domains such as high-performance computing (HPC) and artificial intelligence (AI) including requirements for high-density integration, high bandwidth, and thermal management. Special attention will be paid to HPC customers’ specific demands for large-scale parallel computing chip packaging

b) Establish and maintain relationships with key customers through regular visits to gain deep insights into their product roadmap, particularly regarding HPC chip iteration plans and CPO implementation plans for data center network upgrades, aiming to become a trusted technical and business partner.

2. Demand Analysis, Solution Alignment, and Capex Investment Requirement Assessment

a) Conduct in-depth analysis of customers' specific needs for advanced packaging, covering technical indicators, cost budgets, mass production cycles, application scenarios, etc. For HPC customers, evaluate their packaging requirements for high-speed inter-chip interconnection and efficient heat dissipation; for CPO requirements, understand specialized process demands for integrating optical modules with chips. Leverage the company's advanced packaging capabilities (including existing processes, R&D priorities and production capacity) to develop tailored solutions, such as recommending suitable packaging formats and providing sample testing support.

b) Serve as liaison between customers and internal technical teams, ensuring accurate transmission of customer needs to R&D and engineering departments, facilitating internal resource alignment, and ensuring the solution feasibility and competitiveness.

c) Focus on customers' capacity needs and technical upgrade plans in long-term partnerships, and identify potential Capex investment requirements in alignment with the growth objectives of the company's advanced packaging business.

3. Market and Competitor Analysis, and Insights for Capex Investment Strategies

a) Research trends in the advanced packaging market, with emphasis on technological evolution, expansion of mainstream application, and policy impacts in HPC, and CPO sectors. Analyze competitors' product portfolios, pricing strategies, customer engagement approaches, and Capex investment trends — such as their initiatives in expanding advanced packaging capacity for HPC chips, and commercializing CPO packaging technologies—to inform the company's business decisions and Capex investment strategies.

b) Collect customer feedback and industry intelligence to support the optimization of the company’s advanced packaging technology roadmap, product portfolio, pricing strategies, and Capex investment prioritization. Specifically, for HPC and CPO businesses, drive rational investments in relevant advanced packaging, R&D and capacity development based on market dynamics and customer demands.

4. Internal Collaboration, Resource Coordination, and Capex Investment Execution

a) Collaborate with R&D teams to participate in market validation of new advanced packaging technologies and processes, accelerating the conversion of technical innovations into commercial products—with a focus on HPC, and CPO-related advanced packaging technologies. Examples include participating in R&D validation of high-bandwidth, low-latency packaging for HPC chips, and technical optimization of memory packaging to enhance storage density and read/write speeds, and industrialization of CPO optoelectronic co-packaging technologies, while jointly assessing Capex requirements for scaling new technologies.

b) Coordinate with finance, production, and other departments to contribute to feasibility analysis of Capex investment projects. From a business development perspective, articulate market demand drivers and customer collaboration potential to facilitate smooth project progression and execution, ensuring investments effectively support business growth in HPC and CPO advanced packaging.

Qualifications:

1. Min Bachelor Degree in any disciplines

2. Technical comprehension

• Understand mainstream advanced packaging technologies (principles, processes, and applications) align customer technical needs with company capabilities.

3. Business development

• Sharp market insight, proactively identify potential customers’ advanced packaging needs and develop targeted expansion strategies.

4. Communication and negotiation

• Strong Chinese-English (listening, speaking, reading, writing), efficiently communicate with customers’ senior management/technical teams, convey company value, and finalize business negotiations/contracts.

5. Resource integration

• Coordinate internal tech, R&D, and production teams to deliver customized advanced packaging solutions

6. Project management:

• Track end-to-end business processes (demand docking -> solution design ->order delivery), ensure smooth project progress and resolve cooperation issues.