Semicon Process Senior/Engineer (AOI) - #1114509

Summary

To develop and optimize AOI and reflow process technologies to ensure stable mass production and high product quality in advanced packaging lines, and to support customer and internal quality requirements.

Job

•           Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes

•           Operate and optimize 2D/3D AOI systems and inspection parameters

•           Configure AOI inspection algorithms for new product designs

•           Set up process conditions and equipment configurations for new packages and production lines

•           Optimize reflow parameters and temperature profiles

•           Analyze solder/micro bump quality and implement improvements

•           Conduct root cause analysis and implement corrective actions for process issues

•           Support customer quality requirements through technical evaluation and documentation

•           Supports mass production and quality control in the advanced semiconductor packaging process

•           Contributes to defect reduction, process stability, and customer satisfaction

•           Drives yield and reliability improvements in AOI and reflow process areas

Requirement:

•           Bachelor’s degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)

•           Minimum 3 years of experience in AOI or reflow process in semiconductor backend

•           Ability to establish process conditions and optimize parameters

•           Strong data analysis and problem-solving skills

•           Proficient in writing technical documents and communicating in English

•           Knowledge of inspection or reflow/soldering principles

•           Experience in defect analysis and developing defect evaluation criteria

•           Required experience with bump and RDL inspection

•           Basic understanding of thermal, electrical, and material behavior in reflow processes

•           Experience in advanced packaging process such as 2.5D, fan-out and flip-chip

•           Familiarity with quality tools such as APQP, FMEA and 8D methodology

•           Experience in responding to customer quality requirements or certification audits

•           Ability to write technical documentation and communicate in English

•           Hand-on experience with major AOI equipment(e.g., KLA, onto, Camtek)

•           Collaborative experience in AOI image analysis and algorithm development

•           Experience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids.

•           Experience in quality and reliability evaluation related to reflow or soldering processes

•           Understanding of associated assembly/joining processes (eg. Bonding, chip attach)

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 5WV9W6W5