TCB Mechanical Design [ Semiconductor / Machine Design / Thermal Compression ] - #1106896

Position title : TCB (Thermo Compression Bonding) Mechanical Design Engineer

Location: Admirax St
Working Days:  5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Key Responsibilities:

• Design and Develop modules for Thermal Compression Bonder for Chip-to-Wafer or Chip-to-Substrate bonding.

• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.

• Planning, Scheduling and Costing of Machines and Mechanical Modules

• Working closely with Electrical, Vision and Software Engineers.

• Work extended hours in critical phases of project execution.

• Travel for Machine Installations and Buy Off

• Work closely with process Team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls).

• Support technology transfers from R&D to production.

• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.

• Maintain compliance with environmental, health, and safety standards.

Qualifications:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

• Experience with TCB or Laser Assisted bonding technologies is highly preferred.

• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

• Strong analytical and problem-solving skills, including statistical analysis (JMP, Minitab).

• Knowledge of bonding process and materials behavior under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).

• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus

• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested Personal kindly email to : [email protected]

Lydia Chieng Zhi Yee Reg No: R1988890

The Supreme HR Advisory Pte Ltd EA No: 14C7279