Associate Engineer (MNC-Wafer Bumping) - #1105759

Our client, a global leader in outsourced semiconductor assembly and test (OSAT) services, provides cutting-edge packaging and testing solutions for the semiconductor industry

Job Details:

• Salary UP to $3,500

• Shift Allowance: $10 (Day ) / $15 (night)

• Rotating Shift: 3 Months Rotate 

• Shift Pattern: 3-4-4-3

• 7:00am  - 7:10pm  /  7:00pm - 7:10am

• Working location: Serangoon / Ang Mo Kio

Job Responsibilities:

• Maintain dry process lines (Sputter, Photolithography, Descum)

• Support lot disposition and OCAP execution

• Participate in yield and cost improvement projects

• Coordinate with QM to address customer issues

• Ensure SPC compliance and process control

• Assist in new material evaluations and tool setups

• Perform other duties as assigned by management

Job Requirement:

• Wafer bumping experience is mandatory

• Expertise in Automatic Optical Inspection (AOI), Lithography, PVD, CVD, Sputter, Process Integration, SPC (Statistical Process Control) background

Please submit your updated resume in MS Word format by clicking the QUICK APPLY button.

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Chan Yue Yi
Registration Number: R23112442
AlwaysHired Pte Ltd
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