Semicon AOI Process Engineer /Senior Engineer - #1165977

Job Summary

• We are seeking a motivated Engineer to develop, qualify, and industrialize advanced semiconductor packaging solutions, including New Packages (NP), Evolutionary Packages (EP), New Technologies (NT), and Emerging Technologies (ET).

• The role focuses on establishing robust, stable, and cost-effective AOI (Automated Optical Inspection) and Metrology processes that align with the company's technology roadmap and support successful product introduction and high-volume manufacturing.

Key Responsibilities

• Lead and execute assigned R&D projects related to AOI and Metrology development.

• Develop AOI/Metrology process capabilities during the R&D phase and establish process stability for New Product Introduction (NPI) and high-volume manufacturing.

• Perform AOI/Metrology evaluations, analyze results, and support process characterization, optimization, and qualification of new package technologies and products.

• Establish inline process data collection methodologies and develop dimensional measurement capabilities to meet new technology and product requirements.

• Provide engineering support for sample builds, qualification activities, and development projects.

• Prepare, review, and maintain technical documentation, reports, procedures, and project records related to AOI/Metrology activities.

• Conduct knowledge transfer and training for Operations teams on developed and qualified technologies.

• Support Operations during Low Volume Manufacturing (LVM) to ensure a smooth and excursion-free production ramp-up.

Qualifications & Requirements

• Bachelor's Degree in Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related engineering/science discipline.

• Strong understanding of AOI/Metrology processes, including equipment, materials, procedures, operational practices, and quality requirements.

• Basic knowledge of wafer-level packaging, semiconductor integration, and assembly processes.

• Familiarity with Design of Experiments (DOE) methodologies and statistical analysis tools such as JMP.

• Good technical writing, documentation, presentation, and communication skills.

• Minimum 2 years of experience in a semiconductor assembly or advanced packaging manufacturing environment is preferred.

• Ability to work independently while collaborating effectively with cross-functional teams.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joy••@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 69••737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:JOB-00366