Staff/Snr Engineer, Microelectronic Assembly - #1164282

The role requires the candidate to design and implements die attach and wirebond processes for New Product Introduction (NPI) solution for microwave/mmwave IC packaging for high frequency applications. The candidate will review and enhance existing packaging processes to improve yield and productivity. He/she shall work with internal resources and packaging suppliers to achieve functional packaging goals.

Job Description

1.Be the subject matter expert of MEDs microelectronic assembly team and advise Design Engineering early in new product development to ensure designs are manufacturable.

2.Operate and supervise, including setup, die attachment and wirebonding equipment for all microelectronics assembly processes.

3.Responsible to develop, design, and test standards and guidelines for developing microelectronics packaging solutions for MEDs customer products in aerospace and defense applications.

4.Responsible to define, develop and qualify new packages such as leadframe/substrate layout, bonding diagram, package outline drawing.

5.Develop assembly processes and establish process documentation that are stable, repeatable, and reliably meet design requirements.

6.Take a leading role in the build of prototypes, first articles, and pre-production assemblies.

7.Support customer products throughout their life cycle, developing and implementing changes as needed.

8.Consistently complete quality work in a timely manner meeting established deadlines.

9.Work with hybrid technology including RF ICs, capacitors, inductors, substrates, and other micro components.

10.Analyse and work to both prototype and released assembly drawings and process documents.

11.To ensure products manufactured in accordance with MEDs quality standards.

12.Train new personnel on all microelectronics assembly processes as required.

Requirements

1.Master/Degree/Diploma in electronic/mechatronic or any other engineering equivalent

2.5-7 years of related microelectronics assembly experience. Preferably in an engineering manufacturing environment where all processes were utilized. Significant work utilizing a microscope.

3.Good knowledge in microelectronics assembly workflow.

4.Knowledge and understanding of packaging design validation standards (ISO, ASTM, etc.), drafting and specification standards is essential.

5.Familiar with industrial electronic standards such as JEDEC a plus.

6.Knowledge and capacity to operate various microelectronics assembly equipment such as epoxy die-attach, eutectic solder attach, wirebonding, pull/shear testing, leak testing etc.

7.Ability to analyse and interpret technical drawings, assembly drawings and work instructions. Make recommendations for changes to improve build processes.

8.Proficient in assembly jig designs.

9.Familiar with industrial or consumer packaging trends.

10.Demonstrate proficiency in 2D/3D mechanical CAD software preferred.