Process Associate Engineer - #1162546

About Stats ChipPAC

At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow’s technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.

Scope of the Job:

• Manage the assigned processes in the production line.

• Responsible for firsthand investigation, defect mapping, affected lot list compilation and resolution of the problem, timely closure of Inspection Reject Report and lot disposition.

• Support NPI lot, engineering evaluation runs and data compilation.

• Responsible for recipe creation, machine buyoff and SPC monitoring.

• Participate in the cost saving, yield improvement and productivity activities.

Required Experience and Qualifications:

• Diploma in Mechanical and Material Engineering or equivalent.

• Experience in the following Semicon processes is preferred: Die/Package Pick & Place, Oven Reflow, Underfill, Molding, Plasma and Laser Mark, Back Grind, Die Sort, Laser Groove, Wafer Saw, AOI and Yield.

• Strong process orientation.

• Good Initiative & follow-up.

• Great problem-solving skill.

Why Join Us?

• Be part of an industry leader shaping the future of semiconductors

• Work with cutting-edge technologies and state-of-the-art equipment

• Clear career development pathways and mentorship from industry experts

• Dynamic, multicultural workplace that values collaboration and innovation

• Comprehensive benefits and employee-centric policies