Senior Wets Process Development Engineer I Semiconductor I GMP11422 - #1160746

A leading semiconductor company is proud to be recognized as one of the 17 companies certified as a 2025 Global Top Employer, and the first and only semiconductor company to achieve this distinction. This recognition reflects the company’s continuous commitment to improvement and excellence, particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

The company is committed to fostering a diverse and inclusive workplace where discrimination is not tolerated. It strives to recruit and retain a workforce that reflects the diversity of the communities around it, while promoting fairness in career development, career opportunities, and remuneration. Candidates who may not meet every requirement are still encouraged to apply, as diverse perspectives are valued and opportunities for growth and learning are provided. Diversity, equity, and inclusion (DEI) are deeply embedded in the company culture.

Job number: GMP11422

Key Responsibilities

• Lead the design and optimization of advanced wet processes, including NiPdAu/ENEPIG plating, wet etching, resist stripping, and precision cleaning modules.

• Perform root cause analysis for complex process defects such as thickness non-uniformity and interfacial passivation using advanced analytical tools (SEM/EDX, AFM).

• Drive technology scaling from lab-scale development to high-volume manufacturing (HVM) readiness for wet processes.

• Evaluate and integrate next-generation chemistries, including stabilizer systems and additive interactions, to improve process performance and margins.

• Design and execute multi-variate DOE to study electrochemical reactions and surface preparation variables.

• Collaborate with Lithography, PVD, CVD, R&D, and Assembly teams to ensure end-to-end process integration and compatibility.

Job Requirements

• Minimum Bachelor’s Degree in Chemical Engineering, Materials Science, Chemistry, or a related Engineering discipline.

• 5 to 10 years of direct experience in semiconductor process development, with strong focus on wet station technologies.

• Proven expertise in electroless and electrolytic plating processes, with experience in NiPdAu chemistry and stabilizer management considered an advantage.

• Strong knowledge of wet etching and wafer cleaning processes, including SC1, SC2, and advanced solvent chemistries.

• Hands-on experience in resist stripping and surface preparation for advanced packaging or FEOL applications.

• Strong analytical capability with proficiency in DOE and SPC methodologies.

• Ability to interpret complex material characterization data to identify issues such as chemical stratification or surface poisoning.

• Strong communication skills with ability to present technical findings clearly to stakeholders.

We regret that only shortlisted candidates will be notified.

Interested applicants may email Lay Yong at lay••••••••@gmprecruit.com for further details, quoting Job Number: GMP11422.

GMP Recruitment Services (S) Pte Ltd | EA Licence: 09C3051 | Tan Lay Yong I Registration No: R23112814