Senior Etch Equipment Engineer(Applied Material) I Semiconductor I GMP10120 - #1160743

A leading semiconductor company is proud to be recognized as one of the 17 companies certified as a 2025 Global Top Employer, and the first and only semiconductor company to achieve this distinction. This recognition reflects the company’s continuous commitment to improvement and excellence, particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

The company is committed to fostering a diverse and inclusive workplace where discrimination is not tolerated. It strives to recruit and retain a workforce that reflects the diversity of the communities around it, while promoting fairness in career development, career opportunities, and remuneration. Candidates who may not meet every requirement are still encouraged to apply, as diverse perspectives are valued and opportunities for growth and learning are provided. Diversity, equity, and inclusion (DEI) are deeply embedded in the company culture.

Job number: GMP10120

Key responsibilities include:

• Acting as the primary equipment owner for assigned tools.

• Monitoring and improving equipment performance (OEE, MTBF, MTTR).

• Maintaining equipment health systems including SPC, FDC, fault code, and alarm monitoring.

• Performing preventive maintenance planning and execution according to OEM standards.

• Conducting advanced troubleshooting across electrical, mechanical, vacuum, RF, gas, and software systems.

• Leading root cause analysis (RCA) using structured methods such as 8D, 5 Why, and Fishbone Diagram.

• Supporting vendors and field service engineers during maintenance and upgrades.

• Collaborating with Process Engineering to ensure tool performance and yield requirements are met.

• Analyzing equipment data (SPC, logs, wafer maps) to drive continuous improvement.

• Supporting chamber matching, qualifications, and equipment upgrades.

• Driving Lean, Six Sigma, and continuous improvement initiatives.

• Supporting capacity expansion and tool optimization projects.

Job Requirements:

• Minimum 6–8 years of experience as an Equipment Engineer in semiconductor wafer fabrication environment.

• More than 5 years of hands-on experience with Applied Materials Dry Etcher systems.

• Must possess strong working experience on Applied Materials Centura Super-e Oxide Etch and DPS Poly Etch equipment.

• Strong troubleshooting and root cause analysis skills for resolving complex equipment issues.

• Experience in leading uptime and yield improvement initiatives to enhance equipment performance and productivity.

• Capable of developing and executing preventive maintenance (PM) and calibration plans.

• Experience in equipment upgrade projects and equipment lifecycle management planning.

• Able to work independently and collaborate effectively with cross-functional teams.

We regret that only shortlisted candidates will be notified.

Interested applicants may email Lay Yong at lay••••••••@gmprecruit.com for further details, quoting Job Number: GMP10120.

GMP Recruitment Services (S) Pte Ltd | EA Licence: 09C3051 | Tan Lay Yong I Registration No: R23112814