Process Engineer (Poly Etch) | Semiconductor I GMP11462 - #1160742

A leading semiconductor company is proud to be recognized as one of the 17 companies certified as a 2025 Global Top Employer, and the first and only semiconductor company to achieve this distinction. This recognition reflects the company’s continuous commitment to improvement and excellence, particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

The company is committed to fostering a diverse and inclusive workplace where discrimination is not tolerated. It strives to recruit and retain a workforce that reflects the diversity of the communities around it, while promoting fairness in career development, career opportunities, and remuneration. Candidates who may not meet every requirement are still encouraged to apply, as diverse perspectives are valued and opportunities for growth and learning are provided. Diversity, equity, and inclusion (DEI) are deeply embedded in the company culture.

Job number: GMP11462

Key Responsibilities

• Manage cost-effective wafer fabrication processes by providing engineering support to production to achieve targeted manufacturing performance.

• Take full ownership of all engineering issues for the assigned process, including trench etch processes within the poly team.

• Maintain and support daily manufacturing activities through real-time problem analysis and timely solution implementation.

• Ensure stable process flow with high quality, high yield, and low cost in collaboration with Maintenance Specialists, Production Supervisors, and Shift Engineers.

• Provide cross-functional, cross-department, and cross-fab support based on operational needs and priorities.

• Train new engineers and share technical knowledge to support team development.

• Support shift operations as required and return to normal shift assignment for process or project work when assigned.

Job Requirements

• Bachelor’s degree in Electrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, or a related discipline.

• Around 2 years of experience in trench etch processes and related challenges, including profile control and process stability.

• Ability to perform real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures, and implement appropriate solutions with relevant stakeholders.

• Able to report inline investigations in real time to process owners with complete and accurate details.

• Ability to set up and optimize process recipes for newly introduced processes.

• Ability to establish a robust process control system to minimize Wafer at Risk (WAR), improve SPC/FDC signal-to-noise ratio, and reduce human dependency.

We regret that only shortlisted candidates will be notified.

Interested applicants may email Lay Yong at lay••••••••@gmprecruit.com for further details, quoting Job Number: GMP11462.

GMP Recruitment Services (S) Pte Ltd | EA Licence: 09C3051 | Tan Lay Yong I Registration No: R23112814