Lead Software Control Engineer – Semiconductor Equipment (TCB / Motion Control) - #1124518

About the Role

PYXIS CF is developing a new Thermocompression Bonder (TCB) platform for HBM, CoWoS and 2.5D/3D semiconductor packaging. We are hiring a Lead Software Control Engineer to architect and implement the core control software for multi-axis motion, real-time synchronization, and precision bonding algorithms.

Key Responsibilities

• Lead real-time software development for multi-axis motion control (XY-θ-Z)

• Design control loops for micro-Z height, force feedback, and thermal ramp/soak control

• Implement deterministic control using EtherCAT, TwinCAT, ACS SPiiPlus, or PMAC

• Architect the full software stack for bonding sequence timing and machine coordination

• Integrate servo drives, motor controllers, sensors, heaters, and calibration systems

• Develop diagnostic, calibration, safety, and error-recovery routines

• Collaborate with mechanical, electrical and process teams to optimize bonding performance

• Mentor junior software engineers and define coding standards

Requirements

• Bachelor’s/Master’s in Software, Electrical, Computer Engineering, Mechatronics, or related

• 5–15 years of experience in motion control, automation, or semiconductor equipment

• Strong experience with real-time control, C/C++, and PID-based systems

• Hands-on knowledge of EtherCAT, TwinCAT, ACS SPiiPlus, or PMAC

• Experience with servo drives, encoder feedback, and high-precision synchronization

• Ability to debug motion/force/thermal interactions using oscilloscopes, logic analyzers

• Experience working in R&D environments developing high-precision machinery

Good to Have

• Semiconductor packaging equipment (die bonder, flip-chip, TCB)

• GPU/vision system integration

• Thermal control systems and high-speed bonding process experience