Semicon Development Engineer X3 ($6.5K, Exp ChipOnWafer, WaferLevelPackaging) - #1124003
People Profilers
INFO : Semiconductor packaging and testing services company, manufacturing and service operations in Singapore, China, and South Korea, serving clients worldwide. Provides semiconductor assembly, packaging, and testing solutions for integrated circuits used in electronics like smartphones, computers, and automotive systems. Plant at Yishun.
Remunerations : Up to $6,500 basic + 13 mths aws + V.Bonus + yearly increment + permanent staff benefit
Responsibilities
Support R&D and process integration activities for 2.5D wafer-level packaging (WLP) technologies, focusing on Die Preparation, Chip Attach, and Molding processes.
Ensures process reliability, manufacturability, and seamless integration for next-generation semiconductor packages used in AI, HPC, and memory applications.
Develop and optimize Chip-on-Wafer (CoW) processes:
-Die Preparation: grinding, laser grooving, dicing saw
-Chip Attach: Thermo-Compression Bonding (TCB), Laser Compression Bonding (LCB)
-Mold: compression or transfer molding for warpage control and chip protection
Perform material evaluations and reliability analyses (e.g., XRF, shear test, SAM).
Design and execute DOE and FMEA to ensure robust process control and yield improvement.
Collaborate cross-functionally with Bumping, RDL, and Failure Analysis teams for process integration.
Monitor industry trends in equipment, materials, and 2.5D/3D packaging technologies.
Support New Product Introduction (NPI) and yield ramp-up through structured problem-solving.
Prepare and maintain process documentation, including flow charts, risk assessments, and engineering reports.
Influence supplier qualification and capital equipment decisions related to 2.5D processes.
Drive production readiness and contribute directly to yield, reliability, and revenue growth.
Requirements
Bachelor’s degree in Materials, Electronics, Chemical, Mechanical Engineering or any related discipline.
At least 3 years of hands-on experience in semiconductor packaging process development (Die Prep, Chip Attach, or Mold).
Strong knowledge of DOE, FMEA, SPC, and failure analysis methodologies.
Familiarity with analytical and reliability tools such as XRF, shear test, SAM.
Excellent documentation, data analysis, and cross-functional communication skills.
Experience in OSAT, Foundry, or Advanced Packaging (2.5D/3D, HBM, Interposer) environments is preferred.
JOB ID : 4RRX3RX5
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed Word format to [email protected]
We regret that only shortlisted candidates will be notified
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building Singapore 049705
DID: 6950 9725
http://www.peopleprofilers.com
Georgez Josiah LIM
License Number: 02C4944
Registration Number : R1108994
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