Senior / Engineer - Bumping NPI - #1121789

Responsibilities:

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer

• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production

• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification

• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer

• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders

• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance

• Develop and grow people project management skills, adopting on dynamic changes and crisis management

• Drive for productivity improvement and cost reduction in process integration

• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

 Requirements:

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent

• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry

• Preferably with Project Management Certification

• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred

• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC / FMEA /JMP/ APQP standard

• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred