Associate Engineer - Test Equipment (WLCSP Process // 12 hours shift) - #1120706

Our client is seeking a Associate Engineer - Test Equipment (WLCSP) to join their team!

Join a sophisticated semiconductor manufacturing facility where you'll be responsible for daily operational equipment issues and strategic recovery actions while specializing in Wafer Level Chip Scale Package (WLCSP) processes. This is an excellent opportunity to develop expertise in advanced semiconductor packaging technologies including taping, wafer mount, backgrinding, laser processes, and die sort operations in a cutting-edge production environment.

About Our Client

Our client is the world's largest provider of independent semiconductor manufacturing services. As a global leader, they specialize in assembly, test, materials, and design manufacturing. The company is committed to meeting the industry's growing demands for faster, smaller, and higher-performance chips. Our client offers a wide portfolio of technology and solutions, including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer-level package, flip chip, system-in-package, and final test. This role presents an excellent opportunity to be part of a dynamic and innovative organization at the forefront of semiconductor technology.

What you'll be doing?

• Operational Excellence Management: Take responsibility for daily operational equipment issues and strategize effective recovery actions to support production requirements while ensuring minimal disruption to manufacturing schedules.

• Equipment Qualification Leadership: Perform comprehensive equipment buy-off and qualification activities for machine installation, modification, upgrade, and maintenance to ensure optimal performance and compliance with specifications.

• WLCSP Process Expertise: Actively participate in Wafer Level Chip Scale Package processes including Taping & Detaping, Wafer Mount, Backgrinding, Laser Grooving, Laser Mark, Dicing, AOI, and Die Sort operations.

• Performance Analytics: Monitor and analyze equipment performance and reliability metrics to identify improvement opportunities and implement preventive maintenance strategies for enhanced operational efficiency.

Who are they looking for?

• Educational Background: Diploma, Higher NITEC, or NITEC in Electronic, Electrical, Mechanical, Mechatronics Engineering, or equivalent qualification providing technical foundation for advanced semiconductor equipment operations.

• Specialized Experience: Tape and Reel experience in wafer level processing and knowledge of vision system operations is preferred, demonstrating understanding of precision semiconductor packaging processes.

• Technical Skills: Strong analytical capabilities and excellent teamwork abilities enabling effective problem-solving and collaborative work in sophisticated manufacturing environments with complex equipment systems.

• Shift Commitment: Ability to commit to either 12-hour permanent day or night shift arrangements to support continuous manufacturing operations and equipment maintenance in semiconductor production environment.

Other Information

• Working Hours: 3-2-2-3, 8am - 8pm or 8pm - 8am (Fixed day shift / night shift)

• Working Location: Woodlands

• Salary: Basic $2600 - $3300 + OT + Shift Allowances + AWS + VB

How to apply

Ready to join this role? Click Apply now to submit your resume and share your availability and expected salary with us!

We encourage all passionate semiconductor engineering professionals to apply - your analytical skills and technical expertise in WLCSP processes are what matter most to us!

All information received will be kept strictly confidential and will be used only for employment-related purposes.

Jobs DB Singapore Pte Ltd | 24C2640

Low Jia Yi | R25127265

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