Semicon R&D Process Engineer / Senior Engineer (MOLD) - #1120109

Our Client is a well establish Semicon company .

5 days week ; Monday- Friday

Role Overview:
Lead and develop wafer-level molding and related processes .

Focus is on process development, optimization, stabilization, and supporting transition to mass production.

Key Responsibilities:

• Develop and optimize wafer-level molding and debonding processes for advanced packaging (2.5D, fan-out, SiP).

• Conduct DOE (Design of Experiments), data analysis (e.g., using JMP), and continuous process improvement.

• Qualify new materials, tools, and equipment for packaging and device integration.

• Validate processes pre-production and stabilize yield.

• Support customer programs with technical solutions and troubleshooting.

• Review and improve FMEA, OCAP, and control plans.

• Enhance molding, debond, and wafer resizing processes.

• Drive process yield and quality improvements.

• Support technical innovation in alignment with global customer needs.

Requirements:

• Bachelor's degree in Mechanical, Materials, or Electronics Engineering.

• At least 3 years’ hands-on experience in wafer-level molding process engineering.

• In-depth knowledge of molding machines, materials, procedures, and quality standards.

• Familiarity with advanced packaging (2.5D, fan-out, flip-chip) and related processes (debonding, warpage, resizing).

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 8XY47V33