Member of Technical Staff/ Engineer, QA (PQC) - #1110110

Silicon Box


Date: 12 hours ago
District: Tampines
Contract type: Full time
Work schedule: Full day
Silicon Box

Position Summary

The Member of Technical Staff (MTS)/ Engineer, QA (Process Quality Control) is responsible to develop & deploy inspection procedures to ensure conformance of material to be released. Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Responsibilities

  • Lead PQC engineers and inspectors in performing yield and product gating checks, ensuring alignment with production goals and driving performance improvement.

  • Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.

  • Develop or enhance procedures and work instructions related to backend PQC processes.

  • Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.

  • Perform data analysis using statistical tools, summarize findings, and present results to relevant stakeholders for alignment, action, and strategic decision-making.

  • Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.

  • Identify chronic process and quality issues and implement permanent corrective actions.

  • Responsible for new product process development and supporting smooth pilot-to-high volume transitions.

  • Collaborate with OSAT process/integration teams to resolve process-related defects impacting yield and product quality.

  • Ensure the relevance and accuracy of Work Instructions, Control Plans, FMEA, and other process control documents.

  • Ensure audit readiness for internal and external audits and manage timely closure of findings.

  • Any other ad-hoc duties as assigned.

Requirements

  • Bachelor’s Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).

  • Minimum 5 years of relevant experience in backend semiconductor packaging processes.

  • Strong foundation in process engineering, yield improvement, and quality control.

  • Proficient in SPC and data analysis tools.

  • Familiarity with FMEA, Control Plans, and OSAT backend processes.

  • Hands-on experience with new product and process evaluations.

  • Effective communicator; capable of presenting data and driving cross-team collaboration.

  • Able to thrive in a fast-paced, high-volume manufacturing environment.


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