Process Manager - #1109305

About Stats ChipPAC 

At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow’s technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations. 

Responsibilities (Actual daily deliverables):

• Oversee the Process Engineering operations.

• Provide technical leadership for engineers to control, sustain and to continuously drive improvement for yield, quality and cycle time.

• Establishing partnership and work with upstream processes such as Bumping and WLD2 Tape and Reel to improve quality and yield performance.

• Establish and improve controls to ensure all products meet customers’ requirements in terms of quality and yield.

• Support on engagement with customers on improvement of process, material and equipment capabilities.

• Lead cross-functional teams such as production and equipment for out-of-control situations and provide decision on lot disposition.

• Continuously improve the yield of qualified products through systematic data analysis.

• Productivity improvement through process redesign to maximize productivity of both equipment and processes.

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Minimum 3 years in managerial/lead role in fast moving semiconductor industry.

• Engineering degree from recognized University.

• Strong in process engineering

• Able to provide technical leadership to a team of engineers for customer issues, yield improvement programs and process development activities.

• Ability to interface directly with customers in addressing quality issues, new product introduction and continuous improvement programs.

• Strong knowledge in JMP, 8D, FMEA, DOE and Systematic Problem solving.

• Experienced in Backgrind and Wafer Saw will be added advantage.

Why Join Us? 

• Be part of an industry leader shaping the future of semiconductors 

• Work with cutting-edge technologies and state-of-the-art equipment 

• Clear career development pathways and mentorship from industry experts 

• Dynamic, multicultural workplace that values collaboration and innovation 

• Comprehensive benefits and employee-centric policies