Semiconductor Process Technician - #1108521

Join a government-affiliated science agency and gain hands-on experience in cutting-edge flip chip bonding technology.

The Opportunity:

• Our client, Government-affiliated Science Agency
• Working Location: Science Park II
• Basic Salary: Up to $3,000 (commensurate with experience)
• Working hours: 4334, 9PM-9AM (Night shift only)
• Training provided (Training on normal shift)
• 1 year contract (Subjected to renewal/conversion)

Job Responsibilities:

• Operate and monitor semiconductor equipment and recover process errors.
• Execute process sequences and document tool parameters and die-level data.
• Transport wafer lots within cleanroom environments.
• Identify areas for improvement in cycle time, utilization, and cost.
• Specialize in flip chip bonding processes including solder bump formation, die alignment, bonding, underfill, and inspection.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
  
  

Job Requirements:

• Nitec/Higher Nitec in Engineering, Electronics, Mechatronics or related fields.
• Strong interest in hands-on technical work and learning from the ground up.
• Hard Skills: Machine calibration, die bonding, tool recovery.
• Soft Skills: Accurate documentation, adaptability, troubleshooting.
• Must be comfortable with night shift operations.
  
  

Next Step:

• Prepare your updated resume (please include your current salary package with full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Simply click on 'Apply here' to drop your resume.
• All shortlisted candidates will be contacted.

Jason Ng
Direct Line: 6697 7967
EA License No: 91C2918
Personnel Registration Number: R23113333