Design Engineer (Wire Bond, Die Bond) - #1106317

Key Responsibilities
• Design precision tools, jigs, and machine parts used in die bonders, wire bonders, and other backend systems
• Generate and maintain detailed 2D and 3D CAD drawings for fabrication and assembly
• Collaborate with production, QA, and procurement teams to ensure design practicality and manufacturability
• Run functional testing and validation of prototypes; refine designs based on results
• Troubleshoot technical issues from the shop floor and propose design changes when needed
• Drive continuous improvements by identifying better materials, layouts, or manufacturing steps
• Document all work including design specs, test reports, and change history in an organized manner
• Participate in project planning and contribute to efficient allocation of time and design resources

Requirements
• Diploma or Degree in Mechanical Engineering or equivalent
• At least 3 years of hands-on experience in semiconductor tooling or precision component design
• Solid command of CAD tools such as SolidWorks or AutoCAD
• Familiar with die bonding, wire bonding, and other backend assembly techniques
• Strong coordination skills to work cross-functionally with engineering, production, and QA teams
• Able to handle multiple projects while keeping documentation accurate and updated
• Detail-oriented with strong troubleshooting skills in a cleanroom or production setting
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 EA License No: 13C6305

Reg. No.: R1874608 (Lee Jia Hou)