Process Engineer [Thermo-Compression Bonding] - #1102972

(Thermo-Compression Bonding)

Location: Admiralty, Singapore 757438
Working Days:  5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : up to $8000 depends on experience

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.

• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.

• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.

• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).

• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.

• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).

• Support NPI (New Product Introduction) and technology transfers from R&D to production.

• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.

• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.

• Maintain compliance with environmental, health, and safety standards.

• Experience on HBM, COWOS, 2.5D is a definite plus

• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.

• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Quah Siying (Jeslyn) R1982418

The Supreme HR Advisory Pte Ltd 14C7279