Senior / Engineer – Wafer Bumping Equipment - #1102903

Responsibilities:

• Lead Equipment support team for in depth technical analysis

• Carry out effective planning for CM and PM (inclusive of system setup)

• Maintain high equipment reliability with minimal resource requirement

• Equipment startup, installation and maintenance

• Troubleshooting and provide upgrade or improvement to the equipment

• Analyze equipment failure mode and carry out continuous improvement plan

• Liaising and negotiating with external party on parts enquiry and quotation

• Provide training and guidance to subordinates

• Participate OEE and capacity improvement projects

• Generating OPL and operational procedure and document in support of QMS documentation

• Parts tracking and ordering base on system

• Vendor negotiation on support and parts inventory

• ESD system setup and monitoring for all system

• Risk assessment for existing and new system

• Smart factory support and maintenance (AMR, CDS system maintenance)

Requirements:

• Degree in Engineering preferably Mechanical, Electrical, Electronics 

• 3 years of relevant experience preferably in semiconductor industry

• Good problem-solving skills and communication skills